CVE-2019-2306

EPSS 0.2%

Vexday Risk Score

3Bajo

Decisión SSVC (CISA)

Track

Sin señal de explotación → monitorear

CVSS —EPSS 0.2%KEV nãoPoC —Nuclei —Metasploit —Patch —

Ciclo de vida

25 jul 2019Publicada en NVD

Recomendación: Monitorear — sin señal de explotación por ahora.

Improper casting of structure while handling the buffer leads to out of bound read in display in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20

Productos afectados

Qualcomm, Inc. · Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

¿Quieres saber si tu infraestructura está expuesta a esto?

Hablar con TrueHacking →

Referencias

https://www.codeaurora.org/security-bulletin/2019/07/01/july-2019-code-aurora-security-bulletin