CVE-2019-10574

3Vexday Risk Score

Sem sinal de exploração. Nenhum artefato público de exploração conhecido até agora.

ssvc Trackepss 1.6%

probabilidade de exploração

1.6%top 27% das CVEs

exploração observada

nãonenhuma fonte reporta

Lack of boundary checks for data offsets received from HLOS can lead to out-of-bound read in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8016, APQ8017, APQ8053, APQ8076, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9205, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, QCM2150, QCS605, QM215, Rennell, SC7180, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SXR1130, SXR2130

Produtos afetados

Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking

Referências

https://research.checkpoint.com/2019/the-road-to-qualcomm-trustzone-apps-fuzzing/https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin